The SP 30 Tire Pressure Monitoring (TPM) sensor represents Infineon’s third generation of TPM sensors. Based on proven sensor platforms, the SP 30 adds a high level of integration by including a microcontroller and LF-input stage to meet market demands for flexible, customer specific solutions and overall system cost reduction. The sensor design benefits from Infineon’s proprietary and patented solutions aimed at high reliability measurements in harsh automotive environments.

In a specific sensor ASIC the SP 30 combines a silicon micro-machined pressure and acceleration sensor as well as a temperature sensor. The microcontroller ASIC performs signal-conditioning of the sensing data and generates the data protocol which will be transmitted via an external UHF transmitter (e.g. Infineon TDK 5100 or TDK 5101) it also comprises a LF-input stage.

The SP 30 measures pressure (100 kPa to 450 kPa or 900 kPa). The SP 30T, developed for the truck market, measures pressure of 100 kPA up to 1,600 kPA, temperature (–40 °C to +125 °C), supply voltage (2.1 V to 3.6 V) and acceleration (–12 g to +115 g). By integrating these functions with a single ASIC and sensor in one small-footprint DSO14 package, the SP 30 is the ideal product for various space saving tire pressure monitoring applications. The complete pre-calibrated sensor system withstands harsh automotive environments and is ready for instant use. It further enables motion detection for energy efficient designs and provides voltage self diagnosis or fail safe systems.

The highly integrated peripherals including microcontroller, EEPROM, GPIOs, ADC and a two-channel LF receiver reduces overall system component count and costs. An advanced set of library functions plus integrated EEPROM for customer specific software supports easy programming. For design support Infineon offers a SP 30 development kit and a reference board.

For further information please contact your local Sasco Holz branch office.