Leadless MOSFET reduces footprint by 50%

Zetex Semiconductors has announced its first MOSFETs to be packaged in the leadless 2 x 2mm DFN package. With a PCB footprint 50% smaller than industry standard SOT23 packaged devices and an offboard height of just 0.85mm, the ZXMN2F34MA will benefit a range of space-starved switching and power management applications, such as external switches in buck/ boost PoL converters, where PCB footprint, thermal performance and low threshold voltage are of prime importance.

The MOSFET is one of a series of six new low voltage – 20 V and 30 V – N-channel single and dual devices to be introduced by Zetex in a variety of different surface mount packages.

In spite of its miniature size, the 20 V rated ZXMN2F34MA also offers a superior thermal performance to that of the much larger SOT23, with the DFN322 leadless package assuring a thermal resistance that is some 40% lower than comparable parts, enabling cooler running and improved power density. At typical gate source voltages of 4.5 V and 2.5 V, the MOSFET’s respective RDS(ON) values are just 60mΩ and 120mΩ. In addition, the low reverse recovery charge of these devices reduces switching loss and EMI problems, making them well suited for low voltage applications in notebook computers, mobile phones and general portable electronics where low in-line power loss is essential to increase recharge intervals.

The DFN322 packaged ZXMN2F34MA ($0.1 in 10k volumes) is complemented by three SOT23 N-channel MOSFETs: ZXMN2F34FHTA, ZXMN2F30FHTA, ZXMN3F30FHTA ($–.08 in 10 k volumes); and two dual N-channel devices in the SO8 package: ZXMN3F31DN8 and ZXMN3G32DN8 ($–.22 in 10k volumes).

For further information please contact your local Sasco Holz Branch Office.